• 台州公务员管理再也不用“往返跑”了!“最多跑一次”撬动组织人事改革 全省首个试点 2019-09-26
  • 女排比赛撞车世界杯揭幕战 郎平不在会有奇迹发生吗? 2019-09-12
  • 海淀:得天独厚的自然条件 2019-09-12
  • 47㎡现代风格,将阳台改成小书房超温馨! 2019-08-29
  • 为了您获得更好的浏览体验,请将您的浏览器更新到最新版本!
    +86.21.6027.8500
    Chinese
    2020年3月18-20日
    上海新国际博览中心

    辽宁三十五选七:专家委员会介绍

    International Advisory Committee Members
           
    Dr. T. C. Chen
    Chair
    IBM Fellow and VP, IBM T.J. Watson Research Center, USA
    Dr. Minhwa Chi
    Co-Chair
    SVP/TD, SiEn (Qingdao) Integrated Circuits Co.
           
    Dr. Philip Wong
    Co-Chair
    Professor, Stanford University, USA
      Dr. Georg Bednorz
    Member
    IBM Fellow, Nobel Laureate, Switzerland
           
    Dr. Qingyuan Han
    Member
    Hans Consulting International, USA
    Dr. Kinam KIM
    Member
    President and CEO, Samsung Institute of Advanced Technology, Korea

           
    Mrs. Ying Shi
    Member
    ICMTIA, China

    Dr. Hailing Tu
    Member
    GRINM, China
           
    Dr. Shichang Zou
    Member
    Chinese Academy of Sciences, China

    Dr. Edward Y. Chang
    Member
    National Chiao Tung University, Taiwan, China
           
    Dr. Shaojun WEI
    Member
    Professor, Tsinghua Universtiy, China

    Dr. Chenming HU
    Member
    Professor, UC Berkeley, USA

           


       
           
           
    Steering Committee Advisors
           
    Mr. Lung Chu
    President,SEMI China
    Vice President,SEMI
    Dr. Hiroshi IWai
    Member
    Tokyo Institute of Technology, Japan
           
    Dr. Tomi T. Li
    Member
    National Taiwan Central University
    Dr. David P. Huang
    Member
    VP, Pall Inc. USA
           
    Dr. Lode Lauwers
    Member
    VP, IMEC, Belgium
       
           
           
    Conference Executive Committee Members
           
    Dr. Steve X. Liang
    Conference Chair, Symp-VII Chair
    VP and CTO of Jiangsu Changjiang Electronics Technology
    Dr. Qinghuang Lin
    Symp-VIII Chair, Conference Executive Co-Chair
    Director, ASML, USA
           
    Dr. Ru Huang
    Symp-I Chair, Conference Co-Chair
    Professor and Dean, Peking University, China
    Dr. Cor Claeys
    Conference Co-Chair and Award Selection Chair
    Professor, KU Leuven, Belgium
           
    Dr. Hanming Wu
    Conference Co-Chair
    Etown IP, China
    Dr. Kafai Lai
    Symp-II Chair
    Sr. Engineer, IBM T.J. Watson Research Center, USA
           
    Dr. Ying ZHANG
    Symp-III Chair
    VP, Applied Materials, USA
    Dr. Beichao Zhang
    Symp-IV Chair
    Sr. Director, HFC Semiconductor, China
           
    Dr. Xinping Qu
    Symp-V Chair
    Professor, Fudan University, China
    Dr. Peilin Song
    Symp-VI Chair, Conference Co-Chair, Publicity Chair
    Manager, IBM T.J.Watson Research Center, USA
           
    Prof. Wenjian Yu
    Symp-IX Chair
    Associate Professor, Tsinghua University, China
    Dr. Hsiang-Lan Lung
    Poster Chair
    Director MXIC, Taiwan, China
           
           
    Symposium I: Device Engineering and Technology
           
    Dr. Ru Huang
    Chair
    Peking University, China
    Dr. Cor Claeys
    Co-Chair
    KU Leuven, Belgium
           
    Dr. Minhwa Chi
    Co-Chair
    SiEn (Qindao) Integrated Circuits Co.
    Dr. Chung Lam
    Co-Chair
    Jiangsu Advanced Memory Technology Co. Ltd., China
           
    Prof. Jong-Ho Lee
    Co-Chair
    Seoul National University, Korea
    Prof. Ming Liu
    Co-Chair
    IME, CAS, China
           
    Prof. Yimao Cai
    Member
    Peking University, China
    Dr. Wensheng Qian
    Member
    HHGrace
    Prof. Mario Lanza
    Member
    Soochow University, China
           
    Dr. Huiling Shang
    Member
    TSMC
    Dr. Zhiqiang Wei
    Member
    Panasonic, Japan
           
    Dr. Hong Wu
    Member
    Technology R&D, SMIC, China
    Prof. Huaqiang Wu
    Member
    Microelectronics, Tsinghua University, Beijing, China
           
    Dr. Frank Bin Yang
    Member
    Qualcomm, USA
    Prof. Mario Lanza
    Member
    Soochow University, China
           
    Prof. Xinran Wang
    Member
    Nanjing University, China
      Prof. Ming Li
    Member
    Peking University, China
           
    Prof. Peng Zhou
    Member
    Fudan Univeristy, China
       
           
    Symposium II: Lithography and Patterning
           
    Dr. Kafai Lai
    Chair
    IBM T.J. Watson Research Center, USA
    Dr. Linyong (Leo) Pang
    Co-Chair
    D2S Inc.
           
      Dr. Qiang Wu
    Co-Chair
    ICRD
    Dr. George Lu
    Co-Chair
    Dow Dupont
           
    Prof. Yayi Wei
    Member
    IMECAS, China
    Mr. Xiaoming Ma
    Member
    Dow Chemical
           
    Dr. Zhimin Zhu
    Member
    Brewer Science, USA
      Dr. Zhibiao Mao
    Member
    Nata Chemicals
           
    Mr. Motokatsu.Imai
    Member
    今井 基勝, 水戸工業(株)
    Dr. Hai Deng
    Member
    Fudan University, China
           
    Dr. Shiyuan Liu
    Member
    Huazhong University of Science and Technology , China
    Dr. Wang Yueh
    Member
    Intel, USA
           
    Dr. Ban-Ching Ho
    Member
    Nissan Chemicals
    Dr. Yuyang Sun
    Member
    Photronics




    Dr. David H. Wei
    Member
    ASML Brion
    Dr. Chris Progler
    Member
    Photronics




      Dr. Weimin Gao
    Member
    ASML
       
           
    Symposium III: Dry &Wet Etch and Cleaning
           
    Dr. Ying ZHANG
    Chair
    Applied Material, USA
    Dr. Maxime Darnon
    Co-Chair
    French Institute for Scientific Research (CNRS), France
           
    Dr. Tom Ni
    Co-Chair
    AMEC, China
    Mr. Jinrong Zhao
    Member
    North Microelectronics, China
           
    Dr. Sebastian Engelmann
    Member
    IBM T.J.Watson Research Center, USA
    Dr. Steven Zhang
    Member
    SMIC, China
           
    Dr. Kaidong Xu
    Member
    IMEC, Belgium
    Dr. Ying Huang
    Member
    Applied Material, China
           
      Dr. Huiyuan Pei
    Member
    Lam Research, China
    Dr. Wendy Yan
    Member
    IBM, Thomas J. Watson Center, USA
           
      Dr. Kevin Zhou
    Member
    Applied Materials, USA
    Dr. Ying Xiao
    Member
    TEL, China
           
    Dr. Jianping Zhao
    Member
    TEL, USA
       
           
    Symposium IV: Thin film, Plating and Process Integration
           
    Dr. Beichao Zhang
    Chair
    HFC Semiconductor, China
    Dr. Zhen Guo
    Co-Chair
    Intel, China
           
    Mr. Xiaoping Shi
    Co-Chair
    Beijing Naura Microelectronics, China
    Dr. Chao Zhao
    Co-Chair
    IMECAS, China
           
    Dr. Huang Liu
    Co-Chair
    GLOBALFOUNDRIES, USA
    Dr. Jiang Yan
    Co-Chair
    North China University of Technology, China
           
    Dr. Ran Liu
    Co-Chair
    Fudan University, China

    Dr. Ning Cheng
    Member
    Intel, USA
           
    Dr. Jon REID
    Member
    Lam Research, USA
    Prof. Yu-Long Jiang
    Member
    Fudan University, Shanghai
           
    Dr. Li-Qun Xia
    Member
    AMAT, USA
    Dr. Julian Hsieh
    Member
    ASM, Taiwan, China
           
    Dr. Chih-Chao Yang
    Member
    IBM Research
    Dr. Jianhua Ju
    Member
    Assistant Director, SMIC Tech R&D
           

    Dr. Ganming Zhao
    Member
    Applied Materials

    Dr. Zheyao Wang
    Member
    Tsinghua University, China

         

    Dr. Larry Zhao
    Member
    Lam Research, USA

    Dr. Jiaxiang Nie
    Member
    Lam Research, China

       
           

    Mr. Allen Liu
    Member
    IMEC, Belgium
       
           
    Symposium V: CMP and Post-Polish Cleaning
           
    Dr. Xinping Qu
    Chair
    Fudan University, China
    Dr. Yuchun Wang
    Co-Chair
    Anji Microelectronics, China
           
    Dr. Jingxun Fang
    Co-Chair
    Huali Microelectronics Corporation, China
    Dr. Kuochun Wu
    Co-Chair
    Cabot Microelectronics, Asia
           
    Dr. Paul-Chang Lin
    Member
    Semiconductor Global Solutions(SGS), China
    Dr. David P. Huang
    Member
    Pall Corporation, USA
           
    Dr. Jin-Goo Park
    Member
    Hanyang University, Korea
    Dr. Kailiang Zhang
    Member
    Tianjin University of Science & Technology, China
           
    Dr. Mahadevaiyer Krishnan
    Member
    IBM, USA
    Dr. Shoutian Li
    Member
    Anji Microelectronics, China
           
    Dr. XinChun Lu
    Member
    Tsinghua University , China
      Dr. Wen-Chiang Tu
    Member
    Applied Materials, USA
           
    Dr. Chao-Chang Arthur Chen
    Member
    NTUST, Taiwan, China


           
           
    Symposium VI: Metrology, Reliability and Testing
           
    Dr. Peilin Song
    Chair
    IBM, USA
    Dr. Baozhen Li
    Co-Chair
    IBM System and Technology Group, USA
           
    Dr. Frank Feng
    Member
    Mentor Graphics Corporation, America
    Dr. Yiping Xu
    Member
    Raintree Technologies Corp
           
    Dr. Yuhua Cheng
    Member
    Peking University, China
    Dr. Francis Jen
    Member
    KLA Tencor, China
           
    Dr. Kelvin Xia
    Member
    Advantest, China
    Dr. Srinivas Raghvendra
    Member
    Synopsys, USA
           
    Dr. Xiaowei Li
    Member
    IMECAS, China
    Dr. Yu Huang
    Member
    Mentor Graphics, USA
           
    Dr. Jian-fu Zhang
    Member
    Liverpool John Moores University, England
    Dr. Houken Tseng
    Member
    Teradyne, Greater China, China
           
    Dr. Yu Zhu
    Member
    TSMC
    Dr. Ye Feng
    Member
    Technical Director, Lam Research, USA
           
    Dr. Tung-Yang Chen
    Member
    AIP Technology Corporation, Taiwan, China

     
           
           
    Symposium VII: Packaging and Assembly
           
    Dr. Steve X. Liang
    Chair
    Jiangsu Changjiang Electronics Technology Co., Ltd, China
    Dr. Yifan Guo
    Co-Chair
    ASE Shanghai
           
    Dr. Huili Fu
    Co-Chair
    HiSilicon
    Dr. Mark Huang
    Member
    A-kelon (Huizhou) Optronics Ltd, China
           
    Prof. Mingliang Huang
    Member
    Dalian University of Technology, China
    Prof. Kuan-Neng Chen
    Member
    National Chiao Tung University
           
    Dr. Shin-Puu Jeng
    Member
    TSMC
      Prof. Xing Wu
    Member
    East China Normal University
           
    Prof. Wenhui Zhu
    Member
    Central South University
      Mr. John Rowland
    Member
    Spreadtrum
           
    Dr. John Yuanlin Xie
    Member
    Altera Corp., CA, USA
    Dr. Roy Yu
    Member
    IBM, Watson Research Center, USA
           
    Dr. Yishao Lai
    Member
    ASE. Taiwan, China
    Dr. Jing Shi
    Member
    Oracle, USA
           
    Dr. Young Do Kweon
    Member
    Samsung, Korea
    Dr. Renzhe Zhao
    Member
    Huawei, China
           
      Dr. Hong SHI
    Member
    Xilinx
    Dr. Tim Bao
    Member
    Air Products and Chemicals, Inc
           
    Dr. Tim Chen
    Member
    Yantai Darbond Technology Co., Ltd.
    Dr. Daniel Lu
    Member
    Henkel
           
    Dr. Wang Su
    Member
    Shanghai Sinyang Semiconductor Materials Co., Ltd.,
    The board of Sinyang Semiconductor (Shanghai)
    Technology and Innovation Co., Ltd.
    Prof. Horng-Show (Frank) Koo
    Member
    Minghsin University of Science and Technology(MUST)
           
           
    Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies
           
    Dr. Qinghuang Lin
    Chair
    ASML, USA
    Prof. Hyungjun Kim
    Co-Chair
    Yonsei University, South Korea
           
    Dr. Hsiang-Lan Lung
    Co-Chair
    Macronix International Ltd., Hsinchu, Taiwan, China
    Dr. Zhiyong Ma
    Co-Chair
    Intel
           
    Prof. Jingwei Bai
    Member
    Tsinghua University, China
    Prof. Edward Y. Chang
    Member
    National Chiao Tung University, Taiwan, China
           
    Dr. Kangguo Cheng
    Member
    IBM, USA
    Prof. Jinn P. Chu
    Member
    National Taiwan University of Science and Technology, China
           
    Prof. Thomas Otto
    Member
    Fraunhofer Institute for Electronic Nano Systems ENAS, Chemnitz, Germany
    Prof. Zheyao Wang
    Member
    Tsinghua University, China
           
    Prof. Daniele Lelmini
    Member
    Politecnico Di Milano, Italy
    Prof. Wei Wang
    Member
    Peking University, China
           
    Prof. Fuhua Yang
    Member
    Institute of Semiconductor, Chinese Academy of Sciences, China
    Dr. Wang Yueh
    Member
    Intel, USA
           
    Prof. Zhen Zhang
    Member
    Uppsala University, Sweden
    Dr. Chang CHEN
    Member
    SITRI, China
           

    Dr. Huamao LIN
    Member
    SITRI, China
       
           
    Symposium IX: Design and Automation of Circuits and Systems
           
    Prof. Wenjian Yu
    Chair
    Tsinghua University, China
    Prof. Cheng Zhuo
    Co-Chair
    Zhejiang University, China
           
    Prof. Weikang Qian
    Co-Chair
    University of Michigan-Shanghai Jiao Tong University Joint Institute, China
    Prof. Yiyu Shi
    Member
    University of Notre Dame, USA
           
    Dr. Jinjun Xiong
    Member
    IBM T.J. Watson Research Center, USA
    Prof. Yu-Guang Chen
    Member
    Yuan-Ze University, Taiwan, China
           
    Prof. Baoyong Chi
    Member
    Tsinghua University, China
    Prof. Yinhe Han
    Member
    Chinese Academy of Science, China
           
      Dr. Li Li
    Member
    Synopsys Inc., Shanghai
      Dr. Bing Li
    Member
    Technical University of Munich, Germany
           
    Prof. Shaojun Wei
    Member
    Tsinghua University, China
    Prof. Le Ye
    Member
    Peking University, China
           
      Prof. Xiaoyang Zeng
    Member
    Fudan University
    Prof. Pingqiang Zhou
    Member
    Shanghai Tech University
           
      Prof. Chuan Zhang
    Member
    Southeast University
    Prof. Wanyuan Qu
    Member
    Zhejiang University
           
    Dr. Jianli Chen
    Member
    Fuzhou University
      Dr. Changhao Yan
    Member
    Fudan University
           
           

    山东扑克三开奖号码 www.kd2d.com

    Conference Questions   Sponsorship Contact  
           
    April Peng, SEMI China Cheryl Qiu, SEMI China June Wu, SEMI China  
    Email: [email protected] Tel: 86.21.6027.8552 Tel: 86.21.6027.8523  
      Fax: 86.21.6027.8511 Fax: 86.21.6027.8511  
      Email: [email protected] Email: [email protected]  
           
           

  • 台州公务员管理再也不用“往返跑”了!“最多跑一次”撬动组织人事改革 全省首个试点 2019-09-26
  • 女排比赛撞车世界杯揭幕战 郎平不在会有奇迹发生吗? 2019-09-12
  • 海淀:得天独厚的自然条件 2019-09-12
  • 47㎡现代风格,将阳台改成小书房超温馨! 2019-08-29
  • 竞猜足彩串8乘70奖金 四肖必中三期 四不像生肖图片正版一肖中特 欧洲三大博彩公司 陕西快乐10分钟开奖结果查询 时时彩投万位,稳赚方法 快乐十二基本 基诺开奖 极速快三综合走势图 我的汤姆猫破解版 7星彩开奖结果查询今天晚 中彩网图表走势图表 黑龙江20选8遗漏 上海基诺开奖结果查询 混合过关错一场有奖吗